Description
Specifications
Color : Gray
Thermal Conductivity : >2.2W/m-k
Thermal Impedance : <0.125 Centigrade-in2/W
Specific Gravity : >3
Evaporation : <0.005%
Bleed : <0.05%
Thermal Conductivity : >2.2W/m-k
Thermal Impedance : <0.125 Centigrade-in2/W
Specific Gravity : >3
Evaporation : <0.005%
Bleed : <0.05%
Weight : 0.0013 lbs
Dielectric Constant A : >5.0
Operation Temperature : -50~240 Centigrade
Silicone Compounds : 50%
Carbon Compounds : 10%
Metal Oxide Compounds : 40%
Operation Temperature : -50~240 Centigrade
Silicone Compounds : 50%
Carbon Compounds : 10%
Metal Oxide Compounds : 40%
Product description
Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat disipation of your processor. The thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. This ensures that the heatsink and fan can work at their full capacity to remove the harmful heat away from the CPU, and prevent burnout or heat damage.